Taiwan’s Winbond sees tighter global memory supply
台灣華邦電預期全球記憶體供應將更加吃緊
| TAIPEI (Taiwan News) — Winbond Electronics President Chen Pei-ming (陳沛銘) said Thursday that global memory supply is expected to be tighter next year as AI demand continues to outpace new capacity.
Speaking at an investor conference, Chen said demand is rising across AI data centers, networking equipment, automotive electronics, industrial systems, and edge AI applications, per UDN. While Winbond does not supply the main memory used in AI servers, it has seen growing demand for its DRAM and NOR Flash products used in switches, communications equipment, and networking infrastructure. Chen said the company does not plan major capacity expansions over the next two to three years, instead focusing on process upgrades and higher production yields. Yield at its 16 nm DRAM line in Kaohsiung has reached nearly 88% and is expected to rise to about 90% by year-end. Winbond’s board has approved construction of its second Module B plant in Kaohsiung, with construction scheduled to begin next year and mass production targeted for 2029, per TechNews. The new fab will support 14-nanometer and 12-nanometer DRAM production using EUV lithography, though Chen said it will take time before the facility increases supply. Chen said AI demand has prompted customers to seek long-term supply agreements, with some already looking to reserve capacity from the new plant for 2029 and 2030. Winbond plans to prioritize strategic customers with stable demand, allowing both sides to plan capacity over the next five to 10 years. Winbond also reported record Q2 results, with revenue rising 56.4% from the previous quarter to NT$59.84 billion (US$1.85 billion). Net profit climbed 139.2% to NT$24.32 billion, while earnings per share reached a record NT$5.40, supported by higher memory prices, an improved product mix, and stronger operating margins. |
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| Michael Nakhiengchanh(Taiwan News, Staff Writer) | |
| 2026-08-10 |
