Grand Process Technology, Taiwan Tech join forces on semiconductor packaging platform
弘塑科技（Grand Process Technology）與台灣科技公司攜手打造半導體封裝設備
| TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science and Technology to build an advanced semiconductor packaging platform and develop semiconductor equipment and key materials.
The Hsinchu-based company supplies semiconductor equipment and chemical materials. It plays a key role in advanced packaging processes such as chip-on-wafer-on-substrate, and its clients include TSMC and Advanced Semiconductor Engineering. The university said the five-year partnership will spend NT$50 million (US$1.6 million) on R&D, per CNA. The collaboration will also focus on talent development, including scholarships for students and opportunities to gain hands-on experience at the company. Company Chair Chang Hung-tai (張鴻泰) said rising demand for AI technology and computing power has pushed advanced packaging from single processes toward integrated solutions. As companies seek better process stability, more reliable materials, and higher yields, the need for more precise equipment and improved material design has also grown. Chang said the company hopes the partnership will help expand its existing technologies into more advanced packaging applications, including advanced electroplating and X-ray inspection technologies. The university said it has focused on R&D in semiconductor manufacturing technology and has research experience in silicon photonics, integrated circuit design, advanced manufacturing processes, and compound materials. The university said the partnership aims to patent joint R&D results. With the company’s 149 patents and experience in advanced packaging, the collaboration is expected to boost the school’s R&D in semiconductor manufacturing. The company reported revenue of NT$6.51 billion last year, up nearly 60% from 2024. December sales were NT$1 billion, about double compared with the same month in 2024, driven by higher demand for advanced packaging, with orders booked through the first half of this year. |
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| Carol Yang Taiwan News, Staff Writer | |
| 2026-03-02 |
